Connecting the Corridor: Where AI meets Silicon

Join us for a full day of panels focused on innovation and AI!

1155 Avenue of the Americas, 41st Floor, New York, NY 10036

December 9th 2025

AM

8:30 am Check-in

9:00 am Welcoming remarks

9:10 am Keynote address

9:35 am Hardware: Innovation in integrated circuit design driving advancements in AI

Explore how recent innovations in integrated circuit (IC) design are powering the next generation of artificial intelligence. Semiconductor leaders will discuss how new architectures and hardware breakthroughs are accelerating model training, improving energy efficiency, and enabling increasingly powerful AI applications.

10:20 am Software: AI innovation

Beyond hardware, software is what transforms AI into real-world solutions. This session will highlight breakthroughs in algorithms, frameworks, and tools that take full advantage of today’s cutting-edge semiconductors. Panelists will address current trends, optimization opportunities, and the challenges of embedding AI across industries.

11:00 am Coffee break

11:20 am NSMC overview

Discover success stories and what’s ahead for the corridor.

Noon Lunch and networking

PM

1:15 pm dvanced packaging driving AI efficiency

Advances in semiconductor packaging are playing a critical role in AI performance and efficiency. This panel will showcase the latest developments in advanced packaging (3D integration, chiplets, heterogeneous approaches) and their impact on reducing power consumption, boosting compute density, and strengthening the region’s competitiveness.

2:05 pm Integrated circuit design from defense industry perspective The defense sector is at the forefront of critical technologies

This panel will examine IC design through the lens of defense priorities, cybersecurity, and technological sovereignty. Experts will share how defense-driven approaches can inspire civilian applications and reinforce the resilience of semiconductor supply chains.

2:45 pm Coffee break

3:05 pm Workforce development

The future of microelectronics and AI depends on the ability to train, attract, and retain top talent. This session will spotlight workforce development initiatives, academic–industry collaborations, and inclusion strategies to prepare the next generation of professionals. Panelists will also discuss cross-border talent mobility between Canada and the United States as a key driver of the Northeast Corridor ecosystem.

4 – 8 pm Networking session

Smarter Fabs: AI at Work Inside the Fab

As semiconductors power the AI revolution, AI itself is redefining how chips are made. This discussion will explore how artificial intelligence inside the fab is unlocking new levels of efficiency, agility, and innovation – from predictive analytics to digital twins that mirror and optimize real-time operations – paving the way for the self-optimizing factories of the future.

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